Buzzer BM1370S-0324-16-Changzhou FHD electronics Co.,Ltd

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Buzzer BM1370S-0324-16

Parts shall be measured under one condition (temperature: 5~35 ℃, humidity: 45% ~ 85% R.H., atmospheric pressure: 860 ~ 1060hPa), unless standard conditions (temperature: 25±3 ℃, humidity: 60±10%R.H. atmospheric pressure: 860 ~ 1060hPa) are adjusted.

Category： SMD electromagnetic passive buzzer

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Keywords: buzzer | horn | materialized film

Product Description

1. Technical Parameter
Measuring condition
Part shall be measured under a condition (Temperature: 5~35℃, Humidity: 45%~85%R.H., Atmospheric pressure: 860 ~1060hPa) unless the standard condition (Temperature: 25±3℃, Humidity: 60±10%R.H. Atmospheric pressure: 860 ~1060hPa) is regulated to measure.

1	Rated Voltage	3Vo-p
2	Operating Voltage	2-5Vo-p
3	Rated Current	Max.80mA ,at 2400Hz 50% duty Square Wave 3Vo-p
4	Sound Output at 10cm	Min. 85dB,at 2400Hz 50% duty Square Wave 3Vo-p
5	Coil Resistance	16±4Ω
6	Resonant Frequency	2400Hz
7	Operating Temperature	-20℃~+70℃
8	Store Temperature	-40℃~+85℃
9	Net Weight	Approx 1.8g
10	RoHS	Yes

2. Dimensions Unit: mm

*Unit: mm; Tolerance: ±0.3mm Except Specified
*Housing Material: Black LCP
*Terminal plate: 2 soldering pads, tin Plating Brass

3. Electrical And Acoustical Measuring Condition

Recommended Driving Circuit

Resonant frequency, 1/2 duty cycle. Square wave.Signal amplitude should be large enough tosaturate the transistor.

Recommended Setting

4.Frequency Response

3Vo-p 50% duty Square wave,10cm

5. Surface mounting condition

5.1 Reflow soldering

Recommendable reflow soldering condition is as follows.

Note :

(1) In automated mounting of the SMD sound transducers on PCB, any bending, expanding and pulling forces or shocks against the SMD sound transducers shall be kept minimum to prevent them from electrical failures and mechanical damages of the devices.
(2) In the reflow soldering, too high soldering temperatures and too large temperature Gradient such as rapid heating or cooling may cause electrical failures and mechanical damages of the devices.

5.2 Soldering pattern

6.Reliability Test

After any following tests the part shall meet specifications without any degradation in appearance and performance except SPL. SPL shall not deviate more than -10 dB from the initial value
a)Ordinary Temperature Life Test
The part shall be subjected to 96 hours at 25±10℃. Input rated voltage
Resonant frequency 1/2 duty Square wave.
B) High Temperature Test
The part shall be capable of with standing a storage temperature of +85 ℃ for 96 hours.
c)Low Temperature Test
The part shall be capable of with standing a storage temperature of -40 ℃ for 96 hours.
d)Humidity Test
Temperature:+40 ℃ 3 ℃ Relative Humidity:90% ~ 95% Duration: 48 hours and expose to room temperature for 6 hours
e)Temperature Shock Test
Temperature:70 ℃/1hour → 25 ℃/3hours →-30 ℃/1hour → 25 ℃/3hours (1cycle)
Total cycle: 10 cycles
f)Drop Test
Standard Packaging From 75cm(Drop on hard wood or board of 5cm thick, three sides, six plain.)
g)Vibration Test
Vibration:1000cycles /min. Amplitude:1.5mm, Duration: 1 hour in each 3 axis

Note:
As this product is not protected from foreign material entering, please make sure that any foreign materials (e.g. magnetic powder, washing solvent, flux, corrosive gas) do not enter this product in your production processes. the functional degradation (e.g. spl down) may occur if foreign material enter it.

6.Packing

packing requirements

1. BMC1370S carrier tape, 450 PCS/disc carrier tape material number: f6-S13701
Upper sealing tape: F6-SF213

2. Inner box item number: F6-054; Inner box size Inner box size 76 * 45.5cm
3. Outer box item number: F6-005; Outer box size 35*32 * 36cm

(each tray is packed in a large PE bag and then put into the inner box; PE bag number: f6-610)

shipping mark requirements

inner box:

according to customer order

outer box:

according to customer order