Parts shall be measured under one condition (temperature: 5~35 ℃, humidity: 45% ~ 85% R.H., atmospheric pressure: 860 ~ 1060hPa), unless standard conditions (temperature: 25±3 ℃, humidity: 60±10%R.H. atmospheric pressure: 860 ~ 1060hPa) are adjusted.
Category： SMD Piezoelectric Passive Buzzer
Keywords: buzzer | horn | materialized film
1. Technical Parameter
Part shall be measured under a condition (Temperature: 5~35℃, Humidity: 45% ~ 85%R.H., Atmospheric pressure: 860 ~ 1060hPa) unless the standard condition (Temperature: 25±3℃, Humidity: 60±10%R.H. Atmospheric pressure: 860 ~1060hPa) is regulated to measure.
|2||Operating Voltage||1~25 Vp-p|
|3||Rated Current||Max.5mA , At 4KHz 50% duty Square Wave 9Vp-p|
|4||Sound Output at 10cm||Min. 80dB, At 4KHz 50% duty Square Wave 9Vp-p|
|5||Capacitance||14000±30% pF At 1KHz|
|8||Net Weight||Approx 1.0g|
2. Dimensions Unit: mm
*Housing Material: Black LCP
*Terminal plate: 2 soldering pads, tin Plating Brass
|3. Electrical And Acoustical Measuring Condition|
a)Ordinary Temperature Life Test
The part shall be subjected to 96 hours at 25±10℃. Input rated voltage Resonant frequency, 1/2 duty Square wave.
B )High Temperature Test
The part shall be capable of with standing a storage temperature of +85℃ for 96 hours.
c)Low Temperature Test
The part shall be capable of with standing a storage temperature of -40℃ for 96 hours.
Temperature:+40℃±3℃ Relative Humidity:90%~95% Duration: 48 hours and expose to room temperature for 6 hours
e)Temperature Shock Test
Temperature:60℃ /1hour→ 25℃/3hours→-20℃/1hour→ 25℃/3hours (1cycle)
Total cycle: 10 cycles
Standard Packaging From 75cm(Drop on hard wood or board of 5cm thick, three sides, six plain.)
(1) No abnormality should be found after reflow
(2) Good soldering to meet soldering requirements
As this product is not protected from foreign material entering, please make sure that any foreign materials (e.g. magnetic powder, washing solvent, flux, corrosive gas) do not enter this product in your production processes. The functional degradation (e.g. SPL down) may occur if foreign material enter it.
6. Surface mounting condition
6.1 Reflow soldering
Recommendable reflow soldering condition is as follows.
Note: (1) In automated mounting of the SMD sound transducers on PCB, any bending, expanding
and pulling forces or socks against the SMD sound transducers shall be kept minimum
to prevent them from electrical failures and mechanical damages of the devices.
(2) In the reflow soldering, too high soldering temperatures and too large temperature
Gradient such as rapid heating or cooling may cause electrical failures and mechanical
damages of the devices.
6.2 Soldering pattern
|1. BP1625S Carrier 800PCS/Plate No: f6-S16251
2.77*46.5 item number for inner box: F6-053
3.35*32*36 item number for outer box: F6-005
according to customer order
by customer order
Mobile two-dimensional code