Products
BM5016S-0340
BM5016S-0340
Parts shall be measured under one condition (temperature: 5~35 ℃, humidity: 45% ~ 85% R.H., atmospheric pressure: 860 ~ 1060hPa), unless standard conditions (temperature: 25±3 ℃, humidity: 60±10%R.H. atmospheric pressure: 860 ~ 1060hPa) are adjusted.
Category: SMD electromagnetic passive buzzer
Keywords: buzzer | horn | materialized film
Product Description
1. Document revision history |
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2.Technical Parameter Measuring condition Part shall be measured under a condition (Temperature: 5~35℃, Humidity: 45%~85%R.H., Atmospheric pressure: 860~1060hPa) unless the standard condition (Temperature: 25±3℃, Humidity: 60±10%R.H. Atmospheric pressure: 860~1060hPa) is regulated to measure. |
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1 |
Rated Voltage |
3Vo-p |
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2 |
Operating Voltage |
2~4Vo-p |
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3 |
Rated Current |
Max.100MA,4000Hz 50% duty Square Wave3Vo-p |
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4 |
SoundOutput at 10cm |
Min.75dB,at4000Hz 50% duty Square Wave3Vo-p |
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5 |
Coil Resistance |
12±3Ω |
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6 |
Resonant Frequency |
4000Hz |
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7 |
Operating Temperature |
-20℃ ~ 70℃ |
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8 |
Store Temperature |
-40℃ ~ 85℃ |
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9 |
NetWeight |
Approx0.1g |
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10 |
RoHS |
Yes |
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3.Dimensions |
Unit: mm |
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*Unit: mm; Tolerance:±0.3mm Except Specified *Housing Material:Black LCP Top(Stainless steel) *Terminal plate: 3 soldering pads, tin Plating Brass
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4.Electrical And Acoustical Measuring Condition |
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Recommended Driving Circuit
Resonant frequency, 1/2 duty cycle. Square wave. Signal amplitude should be large enough tosaturate the transistor. |
RecommendedSetting
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5.Frequency Response
6.Surface mounting condition 6.1Reflow soldering Recommendable reflow soldering condition is as follows.
Note: (1)In automated mounting of the SMD sound transducers on PCB, any bending, expanding and pulling forces or shocks against the SMD sound transducers shall be kept minimum to prevent them from electrical failures and mechanical damages of the devices. (2) In the reflow soldering, too high soldering temperatures and too large temperature Gradient such as rapid heating or cooling may cause electrical failures and mechanical damages of the devices.
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6.2 Recommended Soldering pattern
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7.Reliability Test After any following tests thepart shall meet specifications without any degradation in appearance and performance except SPL. SPLshall not deviate more than -10 dB from the initial value 7.1 Ordinary Temperature Life Test The part shall be subjected to96 hours at 25±10℃. Inputratedvoltage Resonant frequency, 1/2 duty Square wave. 7.2 High Temperature Test The part shall be capable of with standing a storage temperature of 85℃ for96 hours. 7.3 Low Temperature Test The part shall be capable of with standing a storage temperature of-40℃ for96 hours. 7.4 Humidity Test Temperature: 40℃ ±3℃Relative Humidity:90%~95% Duration: 48 hours and expose to room temperature for 6 hours 7.5 Temperature Shock Test Temperature:60℃/1hour→25℃/3hours→-20℃/1hour→25℃/3hours (1cycle) Total cycle: 10 cycles 7.6 Drop Test Standard Packaging From 75cm(Drop on hard wood or board of 5cm thick, three sides, six plain.) 7.7 Vibration Test Vibration:1000cycles /min. Amplitude:1.5mm, Duration: 1 hour in each 3 axes 7.8 Reflow Test Userecommendable reflow soldering condition (as shown in 6.1) (1)No abnormality should be found afterreflow (2)Good soldering to meet soldering requirements
Note: As this product is not protected from foreign material entering, please make sure that any foreign materials (e.g. magnetic powder, washing solvent, flux, corrosive gas) do not enter this product in your production processes. The functional degradation (e.g. SPL down) may occur if foreign material enter it.
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8. Packing
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Contact Us
Mobile Phone: 008613813568186
Fax: 0519-88739926
Mailbox: eve.jiang@czfhd.net
Address: Zhenglu Town, Tianning District, Changzhou City, Jiangsu Province
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